About the role
Role Description This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction. Qualifications
- Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process. Mechanical, thermal and FEA modeling and design experience.
- Proven track-record of product development, from concept through volume production.
- Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
- Excellent analytical and problem-solving skills.
- Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
About AttoTude
The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI.
AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing applications.
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About the role
Role Description This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction. Qualifications
- Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process. Mechanical, thermal and FEA modeling and design experience.
- Proven track-record of product development, from concept through volume production.
- Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
- Excellent analytical and problem-solving skills.
- Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
About AttoTude
The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI.
AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing applications.