Why Redlen Technologies?

Redlen Technologies is a pioneering company that has revolutionized the semiconductor crystal growth and fabrication process.

At Redlen Technologies, innovation is at the heart of everything we do. Our founder's visionary work with the Canadian Space Agency laid the foundation for our groundbreaking Cadmium Zinc Telluride (CZT) sensors, revolutionizing medical imaging, security imaging, and non-destructive testing. We are driving a quantum leap forward in medical CT scanners, elevating diagnostic accuracy while reducing radiation dose– a technological feat that has earned us global recognition. With a commitment to excellence, we have earned the trust of Fortune 500 industry customers, leading to our acquisition by Canon Inc. for $430M– a testament to our industry leadership.

With over 200 dedicated professionals, we take pride in fostering a work environment where Science, Technology, Engineering, and Math (STEM) professionals thrive. As an equal opportunity employer we demonstrate that diversity drives innovation, and we are passionate about building a future where every employee contributes to our mission-driven success. Redlen's teams, mirroring the multifaceted diversity of Canadian society, exemplify our commitment to leveraging a wide range of ideas and backgrounds as a driving force for innovation, business excellence, and pioneering advancements in STEM.

Redlen’s Module Development Department ensures the performance, cost, reliability, and overall development of the company's complex detector modules through to NPI.

As an Senior Hardware Engineer in the Module Development Department at Redlen Technologies, you will play a key role in automating a complex semiconductor growth and device fabrication process to improve production efficiencies and product quality.

This work is expected to be highly challenging with the combination of novel and world leading technology and technically demanding applications. These detector modules are full systems that include custom ASIC/ASSP, embedded controllers, and FPGA based logic. The system incorporates complex electrical circuits including providing high voltage supply for the sensors.

Key responsibilities include:

• Specification, design, implementation, and validation of the detector analog and digital electronics in Redlen application specific radiation detectors
• Perform SPICE simulations and signal integrity analysis to identify gaps in existing detector module designs and implement improvements
• Investigate, debug, troubleshoot, and resolve field failures and performance issues in detector modules, including emissions-related problems
• Board and module level integration of electronic components including FPGAs, uP, memories, and semicustom ASICs
• Contributing to product improvement initiatives including reducing costs, enhancing yield, improving reliability, adding new customer value
• Proactive identification of technologies that put our team in a leadership position to fulfill next generation application requirements and customer needs
• Create clear technical documentation leveraging PLM data structures where applicable
• Perform additional tasks and duties as applicable to the role as assigned and adapt to evolving project needs, contributing flexibly across disciplines when necessary

Experience Required:

• A minimum of 7 years designing electronic circuits
• Strong fundamental and experience in analog designs and simulation with SPICE tools
• Experience with schematic capture and PCB layout
• Experience designing power supply, high voltage and isolation circuits
• Experience with signal integrity analysis of analog and digital signals
• Experience troubleshooting failing circuits and boards
• Experience with high-speed digital circuits

Relevant Skills of Interest:

• High voltage X-ray circuit design
• Mixed signal including DSP, DAC/ADC
• Experience with EMI/ Emissions testing. Using spectrometer, near field probes to identify the emission source
• Altium PCB layout, Cadence Allegro electronic package/module design; Designing multi layer boards
• PCB thermal management
• Post layout analysis, experience with HDI is a plus
• Coding experience is a plus – Python, C++, HDL

Other Requirements:

• Good time management skills and ability to work with limited supervision
• Demonstrated ability to work in a dynamic environment as a member of a cross functional team
• Enthusiasm and willingness to mentor junior engineers
• Comfortable with challenging development projects and emerging requirements
• Excellent oral and written communication skills in English
• Demonstrated positive attitude and self-motivation

Education:

• Bachelor’s or Master’s degree in electrical or electronics engineering, engineering-physics, or equivalent

Salary Range: $115,000-150,000 CAD

At Redlen, we prioritize clarity in our hiring process. The salary range posted above reflects the minimum and maximum for new hire salaries, taking into account factors such as job-related skills and expertise, relevant training and education, and business needs. It is common for ranges to span multiple levels in order to attract top talent across experience levels. It is uncommon to be hired at the top of the range; however, in exceptional cases where a candidate's skills and expertise significantly exceed the role's requirements, we may consider offering a higher salary. If you believe your skill set falls outside this range and you’re interested in exploring opportunities with Redlen, please reach out to our People & Culture Team (T.A. Specialists or Business Partners), specifying how your expertise aligns with our teams, so we can collaborate on potential opportunities. We believe in developing those that demonstrate quality performance and promise.

Total Rewards and Benefits

• Competitive salary and performance-based bonuses.
• Comprehensive health, dental, and vision insurance.
• RRSP retirement plan with employer match component.
• Professional development opportunities.
• Generous paid time off and holidays.
• Vibrant and inclusive workplace culture.