About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. This is an existing vacancy. Your Team, Your Impact The Marvell packaging organization is responsible for supporting customers with advanced package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. What You Can Expect Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development. What We're Looking For Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience. Strong fundamentals in EM, transmission lines and microwave theory Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing. Familiarity with IC package layout tools like APD or PADS Experience with 2.5D/3D package development is highly desired. Ability to automate the SI, PI and Packaging activities using scripting tools like Python. Working knowledge of circuit design tools: Spectre, ADS, HSpice Experience with VNA and TDR measurements for package and PCB characterization Frequency domain and time domain knowledge of high speed signaling Experience with high-speed electronic packaging for digital and analog ICs Power plane design, modeling and analysis using tools like PowerSI, SIwave Familiarity with packaging technologies, materials, package substrate design rules and assembly rules Understanding, debugging and simulations of EMI/EMC problems Track record of new product introduction from concept, through development and production is a plus. Knowledge of the thermal and mechanical analysis of the IC package development is a plus. Experience with channel simulations using MATLAB or ADS or other tools is a plus. A team player Strong communication, presentation, and documentation skills Expected Base Pay Range (CAD) 145,800 - 194,400, $ per annum Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews. These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process. This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. Marvell may employ artificial intelligence technologies to assist in the evaluation of job applications. All application reviews include meaningful human involvement, and no hiring decisions are made solely on the basis of automated processing. #LI-MM1 Join our talent community to hear about company news, job openings and events. Join our Talent Community! Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. 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