MEMS Packaging Engineer

Sheba Microsystems is a Toronto-based high-technology company developing advanced MEMS-based micro-actuator solutions for high-performance camera applications. Our technology combines MEMS innovation, electronics, module assembly and precision manufacturing to enable next-generation imaging systems. As Sheba Microsystems scales its industrialization, supplier network and customer delivery activities, we are looking for a MEMS Packaging Engineer to join our team. This is a permanent, full-time position based at our Toronto, ON office.

Role and Responsibilities

• Develop, assemble, and evaluate MEMS packages and compact camera modules in accordance with engineering drawings, work instructions, specifications, and assembly procedures.
• Develop, optimize, and qualify MEMS packaging and assembly processes, including die attach, adhesive dispensing, wire bonding, lid sealing, and final assembly
• Investigate packaging, assembly, and reliability failures using structured root cause analysis and implement effective corrective and preventive actions.
• Applying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies.
• Operating laboratory equipment according to SOPs, Manuals, Methods, and Risk Assessments
• You will test MEMS devices and the assembled products
• You will work with software engineers to calibrate and optimize the camera module.
• You will conduct dimensions measurements to ensure products are within the specification
• You will contribute to our product plans with ideas for new products and improvements.
• You will contribute to the business and technical plans, by helping to define all of our technical milestones.

Required Qualifications

• You have a Bachelor degree in Mechanical/Electrical Engineering or equivalent.
• 2+ years of experience in MEMS packaging, camera module assembly, or semiconductor packaging in a manufacturing environment.
• Hands-on experience with MEMS package assembly processes, including die attach, wire bonding, lid sealing, adhesive dispensing, and optical alignment.
• Experience investigating assembly, packaging, and reliability failures using structured root cause analysis and corrective actions
• Knowledge of package materials, adhesives, thermal management, stress control, contamination control, and clean manufacturing practices for MEMS devices
• You have an experience in validation, test, and characterization of compact camera module.
• You are familiar with 3D CAD software such as Fusion 360.
• Fluent verbal and written English language ability, including technical language.

Strong assets

• Mandarin Chinese language skills.
• Previous experience in mass production of camera module assembly.
• Extensive experience in wirebonding process optimization.
• Familiarity with MEMS packaging/enclosures.
• Ability to travel frequently as required.

Interested candidates are encouraged to submit a complete résumé and cover letter to careers@shebamicrosystems.com, clearly indicating the job title and reference ID.