Data Center Infrastructure Engineer

Job summary

Design and size rack-scale infrastructure for quantum computers, including cooling distribution units, power distribution units, manifolds, and liquid-cooling loops. Own the mechanical design and integration of subsystem modules, bridging facility-level infrastructure with chassis-level packaging while addressing thermal performance, vibration control, and complex assembly requirements.

Job details

About Xanadu: Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about! Your role and responsibilities: As part of the Hardware Team in Toronto, you will take your experience in delivering complex mechanical, vibration-control, and thermal-cooling solutions and apply it to Xanadu’s rack-scale quantum computer development. In this role, you will bridge facility-level infrastructure design with chassis-level mechanical packaging. You will model and size key rack infrastructure (CDUs, PDUs, liquid manifolds, fiber managers) while owning the mechanical design of the sub-system modules that integrate directly into our racks. With your strong background in mechanical design, thermal/liquid management, and complex assemblies, you will take mechanical ownership of the world's first photonic quantum computers deployed at scale. Basic qualifications and experience: BSc or higher in mechanical engineering or a relevant, related discipline. 5+ years of industry experience in data center thermal/mechanical systems engineering. Proficiency in system-level thermal and hydraulic sizing, including selecting and integrating Cooling Distribution Units (CDUs), Power Distribution Units (PDUs), manifolds, and liquid cooling loops. Hands-on experience with thermal simulations (CFD/FEA) to achieve precise temperature stability, uniform heat distribution, and low vibration across both sub-system enclosures and rack-level environments. Proficiency in GD&T (ASME Y14.5) and tolerance stack-up analysis for complex assemblies, particularly for blind-mate power and fluid connections. Deep familiarity with mechanical packaging (sheet metal design, machined components, structural frames, and quick-disconnect fluid fittings). Self-motivated and adaptable, comfortable working both independently and collaboratively with cross-functional teams (photonic, electrical, optical, and software engineers) in a fast-paced environment. Strong interpersonal and technical communication skills, with a track record of taking end-to-end mechanical ownership of complex hardware deliverables. Preferred qualifications and experience: MSc in mechanical engineering or a relevant, related discipline. 8+ years of combined academic and industry experience, including 3+ years leading mechanical packaging or data center infrastructure projects in a commercial industry environment. End-to-end experience specifying, sizing, or designing rack-scale infrastructure, including liquid-to-liquid / liquid-to-air Cooling Distribution Units (CDUs), secondary fluid loops, manifolds, and high-density Intelligent PDUs. Proven track record in sub-system module packaging, designing complex mechanical assemblies (50+ unique parts) integrating sensitive electronics, high-power compute/optical ICs, or photonic components. Hands-on experience with customized rack frameworks compliant with EIA-310, OCP (Open Compute Project), or custom high-density cabinet standards, including structural load analysis and blind-mate mechanical guide systems. Advanced thermal and hydraulic modeling expertise, using CAD mesh definitions and CFD tools (e.g., Ansys Icepak, SimScale, FloTHERM) to simulate both chip-level cold plate temperatures and macro-level fluid pressure drops across full rack manifolds. Expertise in passive and active vibration mitigation, including structural and acoustic vibration isolation within chassis and interconnect assemblies to protect phase-sensitive optical/photonic paths from pump, fan, or fluid dynamics. Expert-level experience with major CAD and CAM software. Hands-on experience with industry manufacturing techniques for metallic and plastic parts. Hands-on experience with CNC machining and 3D printing to quickly prototype concepts and ideas. Experience liaising with machining centers for parts production. Experience working in multidisciplinary teams to extract requirements. Experience with high-volume sheet metal stamping and forming processes, with a strong understanding of DFM principles. An exceptional candidate will have experience specifying or designing production rack-scale electrical power distribution. This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 140,000 - 180,000+ CAD. You will also be eligible for equity and benefits. Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here. We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at recruiting@xanadu.ai. Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

What you’ll do

Design and size rack-scale infrastructure for quantum computers, including cooling distribution units, power distribution units, manifolds, and liquid-cooling loops. Own the mechanical design and integration of subsystem modules, bridging facility-level infrastructure with chassis-level packaging while addressing thermal performance, vibration control, and complex assembly requirements.

Requirements

A bachelor's degree in mechanical engineering or a related discipline and at least five years of industry experience in data center thermal and mechanical systems are required. Candidates should have expertise in thermal and hydraulic sizing, liquid cooling, simulation, GD&T, tolerance analysis, mechanical packaging, and end-to-end ownership of complex hardware; a master's degree and additional project leadership experience are preferred.

Benefits

• Equity
• Benefits

Listed skills

• Cross-Functional Collaboration · Preferred

Other relevant skills

Identified from the job description. Confirm important requirements above.

• Mechanical Engineering
• Data Center Thermal And Mechanical Systems
• Thermal And Hydraulic Sizing
• Liquid Cooling Systems
• Cooling Distribution Units
• Power Distribution Units
• Thermal Simulation
• Computational Fluid Dynamics
• Finite Element Analysis
• Geometric Dimensioning And Tolerancing
• Tolerance Stack-Up Analysis
• Mechanical Packaging
• CAD And CAM
• Vibration Mitigation
• Design For Manufacturability
• Cross-Functional Collaboration

Job areas

• Engineering
• Technology
• Manufacturing
• Science & Research

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