Engineer/Scientist packaging - R&D

Job summary

The Packaging Engineer will lead the design, assembly process development, and full life cycle management of semiconductor products including lasers and photo-detectors. Responsibilities include creating simulation models, defining assembly jigs, managing manufacturing documentation, and supporting the transfer of products to production.

Job details

ENABLE your future through light. Excelitas is a global technology leader with more than 7,500 employees, focused on delivering market-driven solutions to fulfill the illumination, optical, detection and imaging needs of OEMs and end-users across the biomedical, semiconductor, industrial, consumer products, scientific, security, defense and aerospace sectors. ENGAGE with us today and make your contribution to the future! Join the team that leading technology companies turn to for cutting-edge photonic innovation. At Excelitas Technologies you are how we EXCEL. We are looking for a passionate Packaging Engineer who will participate in or lead the development of new semiconductor products, namely lasers and photo-detectors for commercial, industrial, automotive, medical, aerospace and defense applications. He (she) will be responsible for the packaging design and assembly process development of those products. He (she) will be involved in the full life cycle of the product, from design & development, transfer to production, and including ongoing engineering support for production and product management. Your responsibilities: Design packages (hermetic, quasi-hermetic or non-hermetic); Create simulation models for the thermal and stress analysis of packages; Define assembly and test jigs; Participate to the development of the assembly process and coordinate the assembly of prototypes; Create manufacturing documentation (BOMs, routings, drawings); Plan and conduct product evaluation and qualification for new and modified products against appropriate standards; Write evaluation and/or qualification reports; Support the transfer to production of products; Negotiate specifications with suppliers; Interact with the product manager and application engineer on product definition, specifications and costing; Perform cost, time and feasibility analysis for quote request; Attend and participate in customer liaison meetings as required; Perform other related duties as required. Your qualifications: Possess a Bachelor or master’s degree in Mechanical, Electrical, Pysics Engineering or equivalent; Be a member of the OIQ is an asset ; Be proficient with SolidWorks; Have knowledge of ANSYS; Have experience with electro-optical components; Having knowledge in electrical/electronic is an asset; Have experience of reliability testing and quality control; Have experience of technology transfer and related support documentation; Possess solid data analysis skills; Have the ability to work independently or within a team; Have the ability to work on multiple projects simultaneously; Have knowledge on TO, PCB, ceramic substrate and lead frame assembly technologies; Possess good communication skills and strong motivation are essential; Bilingualism written and spoken (French and English) in order to communicate with other Excelitas sites as well as with international customers. Equal Opportunity/Affirmative Action Employer Minorities/Females/Disability/Gender Identity/Sexual Orientation Excelitas is seeking leaders and innovators to join our global team! Visit: https://jobs.excelitas.com/

What you’ll do

The Packaging Engineer will lead the design, assembly process development, and full life cycle management of semiconductor products including lasers and photo-detectors. Responsibilities include creating simulation models, defining assembly jigs, managing manufacturing documentation, and supporting the transfer of products to production.

Requirements

Candidates must hold a Bachelor or Master’s degree in Mechanical, Electrical, or Physics Engineering and possess proficiency in SolidWorks and ANSYS. Experience with electro-optical components, reliability testing, and technology transfer is required, along with strong data analysis and communication skills.

Listed skills

• Technical Documentation · Preferred
• Data analysis · Preferred
• SolidWorks · Preferred
• Quality Control · Preferred
• Communication Skills · Preferred

Other relevant skills

Identified from the job description. Confirm important requirements above.

• Packaging design
• SolidWorks
• ANSYS
• Electro-optical components
• Thermal analysis
• Stress analysis
• Assembly process development
• Reliability testing
• Quality control
• Data analysis
• Technology transfer
• BOM creation
• Technical documentation
• Product qualification
• Communication skills
• Semiconductors
• Ansys Simulation Software
• Packaging Design
• Product Definition
• Electro-Optics
• Bilingual (French/English)
• Data Analysis
• Assembly Lines
• Printed Circuit Board
• Communication
• SolidWorks (CAD)
• Feasibility Studies
• Engineering Support
• Leadership
• Innovation
• Packaging Engineering
• Photonics
• Product Management
• Prototyping
• Reliability Testing
• Technology Transfer
• Stress Analysis
• Quality Control

Job areas

• Engineering
• Science & Research
• Manufacturing
• Technology
• Packaging Engineer
• Research & Development Engineer
• Mechanical Engineers

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