Optical Packaging & Assembly Engineer

Job summary

Develop and implement optical packaging and assembly processes for integrated photonic devices. Collaborate with various teams to support New Product Introduction and ensure consistent manufacturing outcomes.

Job details

Department: Chip & Test Engineering Location: British Columbia, Canada Compensation: The base annual salary range for this full-time role is between $94,200 and $130,000. This range reflects the minimum and maximum target range for new hire base salary across all Canadian locations. Actual compensation may vary outside of this range and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future. Description Optical Packaging & Assembly Engineers at Photonic are part of a team to realize first-of-their-kind photonic all-integrated circuits for implementing truly scalable quantum technologies. You will be developing, implementing and testing robust and scalable packaging and assembly procedures for a variety of photonic circuits. As an Optical Packaging & Assembly Engineer, you are a specialist in optical alignment and assembly, process development, and NPI (New Product Introduction). You will work in a diverse, fast-paced, and multi-disciplinary team of engineers, scientists and technicians. Please include a cover letter with your resume (in one file) describing how you would be a great fit at Photonic and what attributes you could bring to our growing team. WHAT WE NEED YOU TO DO Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability Establish validation plans and characterize optical performance under relevant operating conditions Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle. Develop assembly stations integrating precision motion, optical metrology, and environmental control Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability. Collaborate across teams to develop robust, manufacturable packaging solutions Define qualification criteria and acceptance standards to support product release WHAT YOU BRING TO OUR TEAM PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline Knowledge of and hands-on-experience with integrated photonics and optics 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification Working experience in new product introduction Excellent teamwork, interpersonal and written communication skills. Good organization, problem solving skills. Strong attention to detail An exceptional candidate will bring: Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR) WHY YOU SHOULD WORK WITH US Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day Inclusive company culture that values collaboration Regular social events and fun activities keep our global team connected Competitive compensation package including base salary, stock options, and relocation assistance for global talent Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account The description above is what we think an ideal candidate would look like for this role. At Photonic, we understand that everyone has a different work and life journey. If you feel your experience is close to what we've described, but you might not meet all the requirements, please still apply! All roles listed are for current vacancies. While artificial intelligence (AI) tools may be used to assist in reviewing applicant profiles, they do not determine candidate outcomes. Our hiring decisions are made by people, not algorithms. We are committed to fostering, cultivating, and preserving a culture of equity, diversity, and inclusion. We embrace and encourage our employees’ differences, knowing that these very differences inspire innovation and build better teams. If there are any accommodations our team can make throughout our hiring process, please let us know.

What you’ll do

Develop and implement optical packaging and assembly processes for integrated photonic devices. Collaborate with various teams to support New Product Introduction and ensure consistent manufacturing outcomes.

Requirements

Candidates should have a PhD or Master's degree in a relevant discipline and at least 3 years of experience in photonic integrated circuit packaging. Strong skills in optical alignment, data-driven process optimization, and teamwork are essential.

Benefits

• Health Insurance • Stock Options • Relocation Assistance • Dental • Life Insurance • Long Term Disability • Employee Assistance Program • Parental Leave Top-Ups • Flexible Spending Account

Listed skills

• Data analysis · Preferred

Other relevant skills

Identified from the job description. Confirm important requirements above.

• Optical Alignment
• Process Development
• New Product Introduction
• Data Analysis
• Packaging Engineering
• Optoelectronics
• Fiber Optics
• Teamwork
• Communication
• Problem Solving
• Attention to Detail
• Design for Manufacturability
• Design for Test
• Design for Reliability
• Optical Metrology
• Environmental Control

Job areas

• Engineering
• Science & Research
• Manufacturing
• Technology