MEMS Packaging Engineer

MEMS Packaging Engineer Sheba Microsystems is a Toronto-based high-technology company developing advanced MEMS-based micro-actuator solutions for high-performance camera applications. Our technology combines MEMS innovation, electronics, module assembly and precision manufacturing to enable next-generation imaging systems. As Sheba Microsystems scales its industrialization, supplier network and customer delivery activities, we are looking for a MEMS Packaging Engineer to join our team. This is a permanent, full-time position based at our Toronto, ON office. Role and Responsibilities · Develop, assemble, and evaluate MEMS packages and compact camera modules in accordance with engineering drawings, work instructions, specifications, and assembly procedures. · Develop, optimize, and qualify MEMS packaging and assembly processes, including die attach, adhesive dispensing, wire bonding, lid sealing, and final assembly · Investigate packaging, assembly, and reliability failures using structured root cause analysis and implement effective corrective and preventive actions. · Applying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies. · Operating laboratory equipment according to SOPs, Manuals, Methods, and Risk Assessments · You will test MEMS devices and the assembled products · You will work with software engineers to calibrate and optimize the camera module. · You will conduct dimensions measurements to ensure products are within the specification · You will contribute to our product plans with ideas for new products and improvements. · You will contribute to the business and technical plans, by helping to define all of our technical milestones. Required Qualifications · You have a Bachelor degree in Mechanical/Electrical Engineering or equivalent. · 2+ years of experience in MEMS packaging, camera module assembly, or semiconductor packaging in a manufacturing environment. · Hands-on experience with MEMS package assembly processes, including die attach, wire bonding, lid sealing, adhesive dispensing, and optical alignment. · Experience investigating assembly, packaging, and reliability failures using structured root cause analysis and corrective actions · Knowledge of package materials, adhesives, thermal management, stress control, contamination control, and clean manufacturing practices for MEMS devices · You have an experience in validation, test, and characterization of compact camera module. · You are familiar with 3D CAD software such as Fusion 360. · Fluent verbal and written English language ability, including technical language. Strong assets: · Mandarin Chinese language skills. · Previous experience in mass production of camera module assembly. · Extensive experience in wirebonding process optimization. · Familiarity with MEMS packaging/enclosures. · Ability to travel frequently as required. Interested candidates are encouraged to submit a complete résumé and cover letter to careers@shebamicrosystems.com, clearly indicating the job title and reference ID.

Develop, optimize, and qualify MEMS packaging and assembly processes including die attach, wire bonding, and lid sealing. Investigate reliability failures using root cause analysis and implement corrective actions while collaborating with software engineers for module calibration.

Requires a Bachelor's degree in Mechanical or Electrical Engineering and at least 2 years of experience in MEMS or semiconductor packaging. Candidates must have hands-on experience with assembly processes, failure analysis, and proficiency in 3D CAD software like Fusion 360.

Identified from the job description. Confirm important requirements above.

• MEMS Packaging
• Camera Module Assembly
• Semiconductor Packaging
• Die Attach
• Wire Bonding
• Lid Sealing
• Adhesive Dispensing
• Optical Alignment
• Root Cause Analysis
• FMEA
• Control Plan
• Gage R&R
• 3D CAD
• Fusion 360
• Statistical Methods
• Thermal Management

• Engineering
• Manufacturing
• Technology

Minimum education

Bachelor’s degree

Minimum experience

2+ years

Apply by

Jan 16, 2027

Posting language

English

Working hours

40 hours per week

Seniority

Entry level

Application method

Direct apply is available