TechInsightsVerified Job Source

Advanced Packaging Analyst

Ottawa, ON
On-site
Posted Aug 27, 2026
1 position

$160,000–$170,000 / year

Opens an external site

Employment type: Full-time
Experience level: Senior · 5+ years
Minimum education: Bachelor’s degree
Apply by: Nov 25, 2026
Posting language: English
Working hours: 40 hours per week

Job summary

You will analyze advanced semiconductor packaging devices by building process flows and measuring critical dimensions from reverse engineering results. Additionally, you will document findings in technical reports and blogs while supporting project teams with technology trend analysis.

Job details

OUR STORY TechInsights is the information Platform for the semiconductor industry. Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future. Over 650 companies and 150,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market intelligence in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com. WHY WORK WITH US Company-sponsored training and development opportunities Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement) Flexible vacation policy Trusted device reimbursement program Community involvement opportunities through charitable alliances: https://www.techinsights.com/community-involvement Wellness resources and support Inclusive environment that prioritizes diversity, equity, and accessibility High-growth company driven by high performance Expected salary range: $160,000 - $170,000 CAD THE OPPORTUNITY As our Advanced Packaging Process Analyst, you’ll join our Technology team as a practiced analyst with in-depth understanding of state-of-the-art advanced packaging. You’ll participate in major campaigns and projects initiated by our client-facing team, analyzing devices manufactured with advanced semiconductor packaging process technology. You’ll build process flows based on device structure, layout, and material analysis, measure critical dimensions from our reverse engineering results, and write the technical reports that inform our customers’ decisions. You’ll also help monitor emerging trends in heterogeneous integration. WHAT YOU’LL DO Build process flows for advanced packaging structures, including hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication. Measure critical dimensions such as TSVs, bump pitch, interposer features, and substrate layers. Annotate images and write technical reports based on reverse engineering results. Review and compare analysis results generation over generation, and foundry/OSAT to foundry/OSAT. Write technical blogs and record video briefings on the state of the art in advanced packaging. Work closely with other analysts and support broader project teams on technology trends, process/materials analysis, and documentation. Answer customer questions on published reports. WHAT YOU’LL BRING Bachelors or Masters degree in a relevant field (Physics, Electrical Engineering, Materials Science, or related). Strong knowledge of advanced packaging structures, materials, and integration schemes. 5+ years of industry experience in a foundry or OSAT in advanced packaging unit processes (hybrid bonding, TSV formation, fan-out, flip chip, interposer fabrication). Experience interpreting results from analytical methods such as SEM, TEM, EDS, EELS, and FIB. Knowledge of wafer probing and package final test processes and hardware will be considered an asset. Familiarity with silicon photonics and co-packaged optics (e.g., optical engine assembly, PIC+EIC integration, optical coupling) are considered an asset but not required. Strong analytical skills and the ability to work across multiple sources of information. Excellent oral and written communication and presentation skills. As part of the recruitment process for this position, you will be required to submit your latest citizenship and/or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations. WORKING ARRANGEMENT 5 days in-office (Ottawa, ON). Technology knows no bounds, and neither does TechInsights. Bringing together talented humans from different perspectives, backgrounds and abilities is something we take seriously. We’re committed to building an inclusive environment that welcomes you to be your authentic self and allows us to push past the boundaries together. TechInsights is committed to meeting the needs of people with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process. AI technology may be used to assist in the screening and assessment of applications for this position. Our recruiters are involved at every stage, and all hiring decisions are made by People and hiring teams. As part of any recruitment process, TechInsights collects and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. Our Privacy policy can be referenced here: https://www.techinsights.com/privacy-policy

What you’ll do

Requirements

Candidates must hold a Bachelor's or Master's degree in Physics, Electrical Engineering, or Materials Science. A minimum of 5 years of industry experience in advanced packaging unit processes is required.