Packaging Engineer - Die Bonding Process

Job summary

The Packaging Engineer will operate, optimize, and improve high-precision die bonding processes and equipment within the hardware group. They are also responsible for daily laboratory maintenance and executing sample build assignments for quantum hardware.

Job details

About Xanadu: Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world. And that is something to be excited about! Your role and responsibilities: As part of the Packaging Team within the Hardware group in Toronto, you will utilize your hands-on expertise in advanced device integration and sample preparation to contribute directly to Xanadu’s rack-scale quantum computer development. In the role of Packaging Engineer, you will work under the guidance of senior engineers to operate, optimize, and improve high-precision die bonding processes and equipment. Additionally, you will provide daily laboratory maintenance, execute sample build assignments, and join a growing team supporting photonic and micro-electronic assemblies for our leading-edge quantum hardware. Basic qualifications and experience: BSc (or higher) in Engineering, Science, or related relevant fields. 2+ years experience working in a laboratory / cleanroom environment. Basic understanding of semiconductor packaging process. Experience in epoxy and flip-chip (F/C) die bonding Basic knowledge of Microscope techniques. Self-motivated, comfortable working both independently and collaboratively Detailed-oriented with a positive attitude towards work. Technical writing skills with a demonstrated ability Preferred qualifications and experience: Experience with Mass Reflow (MR), Thermo-Compression Bonding (TCB), and Laser-Assisted Bonding (LAB). Experience in handling and processing diverse bump materials, including Au, SAC305, SnBi, and other lead-free solders. Experience handling wafers and sensitive optoelectronic assemblies Experience identifying and troubleshooting key defects Experience performing Die Shear Testing & and basic Electrical Testing This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 110,000 - 140,000 CAD. You will also be eligible for equity and benefits. Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here. We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at recruiting@xanadu.ai. Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

What you’ll do

The Packaging Engineer will operate, optimize, and improve high-precision die bonding processes and equipment within the hardware group. They are also responsible for daily laboratory maintenance and executing sample build assignments for quantum hardware.

Requirements

Candidates must hold a BSc or higher in Engineering, Science, or a related field and possess at least 2 years of experience in a laboratory or cleanroom environment. Proficiency in semiconductor packaging processes, die bonding, and microscope techniques is required.

Benefits

• Equity • Benefits

Listed skills

• Recruitment · Preferred
• Technical · Preferred
• precision · Preferred
• assessment · Preferred
• Packaging · Preferred
• preparation · Preferred
• materials · Preferred
• Process · Preferred
• Troubleshooting · Preferred
• maintenance · Preferred
• Integration · Preferred
• positive · Preferred

Other relevant skills

Identified from the job description. Confirm important requirements above.

• Die bonding
• Semiconductor packaging
• Cleanroom environment
• Epoxy
• Flip-chip
• Microscope techniques
• Mass reflow
• Thermo-compression bonding
• Laser-assisted bonding
• Wafer handling
• Optoelectronic assemblies
• Die shear testing
• Electrical testing
• Technical writing
• Device integration

Job areas

• Engineering
• Technology
• Science & Research
• Manufacturing