Advanced Packaging Design Engineer

Job summary

The Advanced Packaging Engineer will design advanced packaging solutions and conduct research and development initiatives. They will collaborate with cross-functional teams and suppliers while managing deliverables to ensure timely delivery.

Job details

Role Description This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction. Qualifications * Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process. Mechanical, thermal and FEA modeling and design experience. * Proven track-record of product development, from concept through volume production. * Ability to work effectively in cross-disciplinary teams and drive technical collaborations. * Excellent analytical and problem-solving skills. * Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.

What you’ll do

The Advanced Packaging Engineer will design advanced packaging solutions and conduct research and development initiatives. They will collaborate with cross-functional teams and suppliers while managing deliverables to ensure timely delivery.

Requirements

Candidates should have experience in advanced silicon packaging and a solid understanding of the assembly process. A Master's degree or higher in Mechanical Engineering, Materials Science, or a related field is required.

Listed skills

• Validation · Preferred
• Product Development · Preferred

Other relevant skills

Identified from the job description. Confirm important requirements above.

• Advanced Silicon Packaging
• Multichip Module Design
• High-Speed Interposer Designs
• Assembly Process
• Mechanical Modeling
• Thermal Modeling
• FEA Modeling
• Product Development
• Cross-Disciplinary Collaboration
• Analytical Skills
• Problem-Solving Skills
• Innovation
• Research and Development
• New Product Introduction
• Architecture Design
• Validation

Job areas

• Engineering
• Technology